What is the Engineering Expo?
Engineering Expo is an annual career fair sponsored by Engineers' Council in partnership with Engineering Career Services. Proceeds from this well-attended event support engineering student organizations and project teams. The 2016 Engineering Expo will be held on two days:
Day 1: Tuesday, September 20, 2016 from 1:00pm to 6:00pm
Day 2: Wednesday, September 21, 2016 from 1:00pm to 6:00pm
NOTE: Employer Registration is closed.
The Engineering Expo is an excellent opportunity to gain visibility for your organization with thousands of interested, highly qualified Ohio State engineering and computer science students seeking co-op, internship, and career employment opportunities. This year, the Engineering Expo will be held on September 20-21, 2016 from 1:00pm to 6:00pm each day. Employers may register for Day 1: September 20, 2016 or Day 2: September 21, 2016. Students may attend both days. Next-day interviews will be held on Thursday, September 22, 2016. Registration requests will be based on the date requests are received.
Interested in scheduling next-day interview space?
Please submit a request through your CareerEngine recruiting account. Questions? Contact the ECS On-campus Recruiting Coordinator, Danielle Corrigan at firstname.lastname@example.org.
The Engineering Expo is an outstanding opportunity for engineering and computer science students to meet with employer representatives and learn about co-op, internship, and career employment opportunities! The Engineering Expo will take place on two days this year! Students should plan to attend BOTH days because there will be different employers on each day.
Day 1: September 20, 2016 and Day 2: September 21, 2016. Expo will be held at the Ohio Union from 1:00pm to 6:00pm Don't miss it!
Programs will no longer be sold! The full program information will be available on your iOS or Android phone. Please search OSU Career Fair+ on the iOS App Store and Google Play marketplace. For students who cannot access this via their phone, a full version of the program will be available for you to print at the link below.